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Design Rule Verification Report

Date : 07/01/2013
Time : 11:07:10
Elapsed Time : 00:00:01
Filename : G:\PCB_final\PCB.PcbDoc
Warnings : 1
Rule Violations : 27

Summary

Warnings Count
Multilayer Pads with 0 size Hole found 1
Total 1

Rule Violations Count
Clearance Constraint (Gap=0.254mm) (InPolygon),(All) 0
Clearance Constraint (Gap=0.15mm) (All),(All) 0
Width Constraint (Min=0.2mm) (Max=5mm) (Preferred=0.5mm) (All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=0.508mm) (Conductor Width=0.254mm) (Air Gap=0.254mm) (Entries=4) (All) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 27
Un-Routed Net Constraint ( (All) ) 0
Hole Size Constraint (Min=0.3mm) (Max=6.2mm) (All) 0
Height Constraint (Min=0mm) (Max=25.4mm) (Prefered=12.7mm) (All) 0
Hole To Hole Clearance (Gap=0.254mm) (All),(All) 0
Minimum Solder Mask Sliver (Gap=0.15mm) (Disabled)(All),(All) 0
Silkscreen Over Component Pads (Clearance=0.254mm) (Disabled)(All),(All) 0
Silk to Silk (Clearance=0.254mm) (Disabled)(All),(All) 0
Net Antennae (Tolerance=0mm) (All) 0
Total 27

Warnings

Multilayer Pads with 0 size Hole found
Pad U2-7(260.3mm,142.9mm) Multi-Layer
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Short-Circuit Constraint (Allowed=No) (All),(All)
Via (172.025mm,90.1mm) Top Layer to Bottom Layer Pad U5-33(173.225mm,91.3mm) Top Layer
Via (172.025mm,92.5mm) Top Layer to Bottom Layer Pad U5-33(173.225mm,91.3mm) Top Layer
Via (173.225mm,90.1mm) Top Layer to Bottom Layer Pad U5-33(173.225mm,91.3mm) Top Layer
Via (173.225mm,92.5mm) Top Layer to Bottom Layer Pad U5-33(173.225mm,91.3mm) Top Layer
Via (172.025mm,91.3mm) Top Layer to Bottom Layer Pad U5-33(173.225mm,91.3mm) Top Layer
Via (173.225mm,91.3mm) Top Layer to Bottom Layer Pad U5-33(173.225mm,91.3mm) Top Layer
Via (174.425mm,90.1mm) Top Layer to Bottom Layer Pad U5-33(173.225mm,91.3mm) Top Layer
Via (174.425mm,92.5mm) Top Layer to Bottom Layer Pad U5-33(173.225mm,91.3mm) Top Layer
Via (174.425mm,91.3mm) Top Layer to Bottom Layer Pad U5-33(173.225mm,91.3mm) Top Layer
Via (260.675mm,142.9mm) Top Layer to Bottom Layer Pad U2-7(260.3mm,142.9mm) Multi-Layer
Via (259.925mm,142.9mm) Top Layer to Bottom Layer Pad U2-7(260.3mm,142.9mm) Multi-Layer
Via (186.375mm,102.75mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (186.375mm,105.15mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (186.375mm,106.35mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (187.575mm,102.75mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (187.575mm,105.15mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (187.575mm,106.35mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (186.375mm,103.95mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (187.575mm,103.95mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (185.175mm,102.75mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (185.175mm,105.15mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (185.175mm,106.35mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (188.775mm,102.75mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (188.775mm,105.15mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (188.775mm,106.35mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (185.175mm,103.95mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
Via (188.775mm,103.95mm) Top Layer to Bottom Layer Pad U4-29(186.975mm,104.55mm) Bottom Layer
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